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NCP1608
Table 1. PIN FUNCTION DESCRIPTION
Pin
1
2
3
4
5
6
7
8
Name
FB
Control
Ct
CS
ZCD
GND
DRV
V CC
Function
The FB pin is the inverting input of the internal error amplifier. A resistor divider scales the output voltage to V REF to main-
tain regulation. The feedback voltage is used for overvoltage and undervoltage protections. The controller is disabled
when this pin is forced to a voltage less than V UVP , a voltage greater than V OVP , or floating.
The Control pin is the output of the internal error amplifier. A compensation network is connected between the Control pin
and ground to set the loop bandwidth. A low bandwidth yields a high power factor and a low Total Harmonic Distortion (THD).
The Ct pin sources a current to charge an external timing capacitor. The circuit controls the power switch on time by com-
paring the Ct voltage to an internal voltage derived from V Control . The Ct pin discharges the external timing capacitor at the
end of the on time.
The CS pin limits the cycle ? by ? cycle current through the power switch. When the CS voltage exceeds V ILIM , the drive
turns off. The sense resistor that connects to the CS pin programs the maximum switch current.
The voltage of an auxiliary winding is sensed by this pin to detect the inductor demagnetization for CrM operation.
The GND pin is analog ground.
The integrated driver has a typical source impedance of 12 W and a typical sink impedance of 6 W .
The V CC pin is the positive supply of the controller. The controller is enabled when V CC exceeds V CC(on) and is disabled
when V CC decreases to less than V CC(off) .
Table 2. MAXIMUM RATINGS
Rating
FB Voltage
FB Current
Control Voltage
Control Current
Ct Voltage
Ct Current
CS Voltage
CS Current
ZCD Voltage
ZCD Current
DRV Voltage
DRV Sink Current
DRV Source Current
Supply Voltage
Supply Current
Power Dissipation (T A = 70 ° C, 2.0 Oz Cu, 55 mm 2 Printed Circuit Copper Clad)
Thermal Resistance Junction ? to ? Ambient
(2.0 Oz Cu, 55 mm 2 Printed Circuit Copper Clad)
Junction ? to ? Air, Low conductivity PCB (Note 3)
Junction ? to ? Air, High conductivity PCB (Note 4)
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Lead Temperature (Soldering, 10 s)
Symbol
V FB
I FB
V Control
I Control
V Ct
I Ct
V CS
I CS
V ZCD
I ZCD
V DRV
I DRV(sink)
I DRV(source)
V CC
I CC
P D
R q JA
R q JA
R q JA
T J
T J(MAX)
T STG
T L
Value
? 0.3 to 10
± 10
? 0.3 to 6.5
? 2 to 10
? 0.3 to 6
± 10
? 0.3 to 6
± 10
? 0.3 to 10
± 10
? 0.3 to V CC
800
500
? 0.3 to 20
± 20
450
178
168
127
? 40 to 125
150
? 65 to 150
300
Unit
V
mA
V
mA
V
mA
V
mA
V
mA
V
mA
mA
V
mA
mW
° C/W
° C
° C
° C
° C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. This device series contains ESD protection and exceeds the following tests:
Pins 1– 8: Human Body Model 2000 V per JEDEC Standard JESD22 ? A114E.
Pins 1– 8: Machine Model Method 200 V per JEDEC Standard JESD22 ? A115 ? A.
2. This device contains Latch ? Up protection and exceeds ± 100 mA per JEDEC Standard JESD78.
3. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 80 mm 2 of 2 oz copper traces and heat spreading area. As specified for
a JEDEC 51 low conductivity test PCB. Test conditions were under natural convection or zero air flow.
4. As mounted on a 40x40x1.5 mm FR4 substrate with a single layer of 650 mm 2 of 2 oz copper traces and heat spreading area. As specified
for a JEDEC 51 high conductivity test PCB. Test conditions were under natural convection or zero air flow.
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